Connection method and connection device for electrical connection of small portions
AssigneeKabushiki Kaisha Toshiba
InventorKatsuya Okumura
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Abstract
A first portion is set near or in contact with a second portion. The first and second portions are electrically connected by spraying fine metal particles particles of gold, nickel or copper in a carrier gas of helium, argon, hydrogen or nitrogen on the first and second portions to form a metal bump. Prior to spraying the fine metal particles to form the metal bump, hard particles of titanium, copper, hafnium, zirconium or vanadium may be sprayed on the first and second portions to remove contamination layers.
Claims15
An electrical connection method for connecting a first portion and a second portion, the method comprising the steps of:
- forming fine metal particles by vaporizing a metal in a first chamber and cooling the vaporized metal;
- carrying the fine metal particles i a carrier gas to a second chamber;
- positioning the first portion near or in contact with the second portion within the second chamber;
- and
- spraying the fine metal particles on said first and second portions to electrically connect the first and second portions.
An electrical connection method for connecting a first member and a second member, the method comprising the steps of:
- forming fine metal particles by vaporizing a metal and cooling the vaporized metal;
- carrying said fine metal particles together with carrier gas;
- positioning the first member near or in contact with the second member;
- and
- spraying the fine metal particles together with the carrier gas on said first and second members to electrically connect the first and second members by fixedly attaching a metal bump thereto.
Dependencies are inferred from the claim text.