Method of and apparatus for wiring board assemblies

In a method of wiring one or two wiring board assemblies, each of which comprises a plurality of pressure terminals or busbars, each having a press-connection portion formed with a slot, and an insulating substrate that supports the pressure terminals or busbars;

• the method of wiring the wiring board assemblies by pressing wires into the slots of the press-connection portions on the wiring board assemblies to form a desired circuitry, comprising the steps of:
• (a') laying a plurality of wires in parallel to each other between one side of the insulating substrate of the wiring board assembly and the other side by operating two or more wire laying heads arranged in parallel;
• (b') supporting an intermediate portion of each wire at two points at an appropriate interval to hold the wires outside the supported intermediate portions straight;
• (c') moving the wire laying heads in a direction perpendicular to the wire laying direction to position the first row wire on the slots of specified press-connection portions on both sides of the wiring board assembly;
• (d') pressing the positioned first row wire into the slots and cutting the wire;
• (e') repeating the steps (c) and (d) to press the second to final row wires into the slots of specified press-connection portions on both sides of one wiring board assembly and cutting the wires;
• (f') rotating the insulating substrate in the same plane of the substrate and repeating the steps (a') to (e') to perform wire laying and press-connection work in a direction crossing the already laid wires;
• and
• (g) repeating the steps (a') to (e') and step (f') selectively for the remaining press-connection portions on the wiring board assembly.

A wiring apparatus for wiring board assemblies comprising:

• a wire laying plate on which the wiring board assemblies are mouted;
• and
• a plurality of wire laying heads arranged in parallel with each other on the wire laying plate, each wire laying head comprising a pair of front and rear heads that move vertically and parallelly with respect to the wire laying plate;
• the front head including, from the front toward the rear, a wire chuck that can be opened and closed, a pressing jig and wire guide pins;
• the rear head including, from the front toward the rear, wire guide pins, a pressing jig and a wire cutter, the rear head further including:
• a wire holding rod located below the members of the rear head, the wire holding rod moving toward or away from the wire chuck of the front head, the wire holding rod having a wire insertion hole and a wire chuck.

A wiring apparatus for wiring board assemblies comprising:

• a wire laying plate on which the wiring board assemblies are mounted;
• a means to rotate the wire laying plate in the same plane as the plate surface;
• and
• a plurality of wire laying heads arranged in parallel with each other on the wire laying plate, each wire laying head comprising a pair of front and rear heads that move vertically and parallelly with respect to the wire laying plate;
• the front head including, from the front toward the rear, a wire chuck that can be opened and closed, a pressing jig and wire guide pins;
• the rear head including, from the front toward the rear, wire guide pins, a pressing jig and a wire cutter, the rear head further including:
• a wire holding rod located below the members of the rear head, the wire holding rod moving toward or away from the wire chuck of the front head, the wire holding rod having a wire insertion hole and a wire chuck.