Flat cable
AssigneeRaychem Corporation
InventorsPhu D. Nguyen, Ashok K. Mehan, Hans E. Lunk, James M. O'Brien
Life of this patent
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Abstract
This invention relates to flat cables comprising a plurality of substantially parallel insulated conductors bonded to a polymeric substrate which has a melting point greater than 200.degree. C. and/or a thickness less than 2.5 mils (98 microns) and a method for the production of such cables.
Claims32
A flat cable comprising:
- (a) a plurality of elongated conductive components each individually surrounded with an outer layer of a first polymeric insulating material;
- and
- (b) a substrate comprising a second polymeric material capable of heat bonding to the first polymeric material;
- the first polymeric material and the second polymeric material, which may be the same or different, being selected from thermoplastic polymers having a melting point greater than 200.degree. C. and the insulated conductive components being bonded to a surface of the substrate and arranged substantially parallel to each other at a predetermined spacing.
A flat cable comprising:
- (a) a plurality of elongated conductive components each individually surrounded with outer layer of a first polymeric insulating material;
- and
- (b) a substrate comprising a second polymeric material capable of bonding to the first polymeric material and having a thickness less than 2.5 mils (less than 98 microns);
- (c) the first polymeric material and the second polymeric material, which may be the same or different, being selected from thermoplastic polymers;
- the insulated conductive components being bonded to a surface of the substrate and arranged substantially parallel to each other at a predetermined spacing.
A method of fabricating a flat cable which comprises;
- (a) arranging a plurality of elongated conductive components each being individually surrounded by a layer of a first polymeric material, and each being substantially parallel to one another;
- (b) providing a substrate comprising a second polymeric material mounted on a surface of a support layer peelably adhered to the polymeric substrate, the support layer comprising a material that is dimensionally stable at a selected temperature at which temperature the substrate and the first polymeric material can be caused to heat bond to one another;
- (c) heating at least one of the first polymeric material or the substrate to the selected temperature;
- (d) bringing the first polymeric material into contact with the substrate;
- (e) cooling the resulting assembly;
- (f) peelingly removing the support layer from the assembly.
A flat cable produced by the method comprising:
- (a) arranging a plurality of elongated conductive components each being individually surrounded by a layer of a first polymeric material, and each being substantially parallel to one another;
- (b) providing a substrate comprising a second polymeric material mounted on a surface of a support layer peelably adhered to the polymeric substrate, the support layer comprising a material that is dimensionally stable at a selected temperature at which temperature the substrate and the first polymeric material can be caused to heat bond to one another;
- (c) heating at least one of the first polymeric material or the substrate to the selected temperature;
- (d) bringing the first polymeric material into contact with the substrate;
- (e) cooling the resulting assembly;
- (f) peelingly removing the support layer from the assembly.
A method of preparing a flat cable comprising a plurality of elongated conductive components, each component being individually surrounded by a layer of a first polymeric material that is bonded to a polymeric substrate and having a preselected bond strength thereto, which comprises:
- (a) arranging the plurality of elongated conductive components each individually surrounded by a layer of a first polymeric material, substantially parallel to one another;
- (b) providing a polymeric substrate mounted on a surface of a support layer peelably adhered to the polymeric substrate, the support layer comprising a material that is dimensionally stable at a selected temperature at which the substrate and the first polymeric material can be caused to adhere to one another;
- (c) heating the conductors or the substrate or both to the selected temperature;
- (d) bringing the conductors into contact with the substrate at a predetermined pressure;
- (e) cooling the resulting assembly;
- (f) removing the support layer from the assembly,
- whereby the insulated conductors manifest the pre-selected bond strength to the polymeric substrate.
A flat cable produced by the method comprising a plurality of elongated conductive components, each component being individually surrounded by a layer of a first polymeric material that is bonded to a polymeric substrate and having a preselected bond strength thereto, which comprises;
- (a) arranging the plurality of elongated conductive components each individually surrounded by a layer of a first polymeric material, substantially parallel to one another;
- (b) providing a polymeric substrate mounted on a surface of a support layer peelably adhered to the polymeric substrate, the support layer comprising a material that is dimensionally stable at a selected temperature at which the substrate and the first polymeric material can be caused to adhere to one another;
- (c) heating the conductors or the substrate or both to the selected temperature;
- (d) bringing the conductors into contact with the substrate at a predetermined pressure;
- (e) cooling the resulting assembly;
- (f) removing the support layer from the assembly.
Dependencies are inferred from the claim text.