Package-type semiconductor laser device
AssigneeRohm Co., Ltd.
InventorsHaruo Tanaka, Naofumi Aoki
Life of this patent
Estimating the term…
Abstract
A package-type semiconductor laser device comprises a metallic heat sink plate, a semiconductor laser chip carried by the heat sink plate, and a cap mounted on the heat sink plate to enclose the laser chip. The cap has a transparent window in opposed relation to the heat sink plate. The laser chip has a front facet oriented so that the laser chip emits an output laser beam generally in parallel to the heat sink plate. The laser device further comprises a reflective member arranged in the cap for deflecting the output laser beam toward the window of the cap.
Claims16
A package-type semiconductor laser device comprising:
- a metallic heat sink plate having a substantially flat support surface and an exposed surface directed away from the support surface;
- a semiconductor laser chip carried by the support surface of the heat sink plate, the laser chip having a front light emitting facet oriented so that the laser chip emits an output laser beam generally in parallel to the support surface of the heat sink plate;
- a cap mounted on the support surface of the heat sink plate to enclose the laser chip, the cap having a transparent window in opposed relation to the support surface of the heat sink plate;
- and
- a reflective member arranged within the cap for deflecting the output laser beam toward the window of the cap.
A package-type semiconductor laser device comprising:
- a metallic heat sink plate having a substantially flat support surface and an exposed surface directed away from the support surface;
- a semiconductor laser chip carried by the support surface of the heat sink plate, the laser chip having a front light emitting facet oriented substantially perpendicularly to the support surface of the heat sink plate for emitting an output laser beam generally in parallel to the support surface of the heat sink plate;
- a cap mounted on the support surface of the heat sink plate to enclose the laser chip, the cap having a transparent window in opposed relation to the support surface of the heat sink plate;
- and
- a reflective member arranged within the cap for deflecting the output laser beam toward the window of the cap.
A package-type semiconductor laser device comprising:
- a metallic heat sink plate having a substantially flat support surface and an exposed surface directed away from the support surface;
- a mount attached to the support surface of the heat sink plate, the mount having a flat mounting surface which is substantially parallel to the support surface of the heat sink plate;
- a semiconductor laser chip attached on the mounting surface of the mount, the laser chip having a front light emitting facet oriented so that the laser chip emits an output laser beam generally in parallel to the support surface of the heat sink plate;
- a cap mounted on the support surface of the heat sink plate to enclose the laser chip, the cap having a transparent window in opposed relation to the support surface of the heat sink plate;
- and
- a reflective member arranged within the cap for deflecting the output laser beam toward the window of the cap.
Dependencies are inferred from the claim text.