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AssigneeTexas Instruments Incorporated
InventorsDean L. Frew, Mark A. Kressley, Arthur M. Wilson, Juanita G. Miller, Philip E. Hecker, Jr., James Drumm, Randall E. Johnson, Rick Elder
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The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.
A multi-chip circuit module comprising a plurality of circuit chips assembled in a laminated stack, each of said chips having a plurality of layers of thin-film interconnect patterns thereon, a final layer of which comprises a reroute pattern that locates all circuit input and output pads along a single edge of each chip, and further including a bonded lead extending from each rerouted I/O pad to a point beyond said single edge of each chip, whereby an array of protruding lead tips extends from a single lateral face of said laminated stack.
Dependencies are inferred from the claim text.