Large scale integrated package structure

LSI package structure in which:

• an LSI package is provided, said LSI package comprising a substrate, at least one LSI loaded on one surface of said substrate, and a power supply pin, a ground pin and a signal input/output pin for said LSI protruded on the other surface of said substrate;
• adjacent to a pin side surface of said LSI package, a power supply member having an electrically conductive portion for power supply bus and an electrically conductive portion for ground bus, and an interconnection board having a power supply pattern layer and a ground pattern layer connected to said electrically conductive portion for the power supply bus and said electrically conductive portion for the ground bus respectively, are disposed;
• said power supply pin, said ground pin and said signal input/output pin each extend through a through hole formed on said interconnection board, said power supply pattern layer and said power supply pin being interconnected within said through hole, said ground pattern layer and said ground pin being interconnected within said through hole;
• and
• at the side of said interconnection board opposite said LSI package, said signal input/output pin and a signal input/output cable are interconnected.