Three-dimensional integrated circuit package
AssigneeFairchild Space and Defense Corporation
InventorEarl R. Nicewarner, Jr.
Life of this patent
Estimating the term…
Abstract
An integrated circuit package that permits high density packaging of circuit chips. The integrated circuit package has a base substrate support member with an upper and a lower surface. A cavity is located in its upper surface and a similar cavity is located in its lower surface. Two circuit chips are located in each cavity that are connected together in back to back relationship. The cavities are closed or sealed by lids that are bonded to mounting surfaces that are located on the base substrate support member and surround the cavities. A series of terminating leads are located on two sides of the base substrate support member that are electrically connected to the circuit chips. A single cavity embodiment is also set forth that is designed for use when a lesser density is acceptable or desired.
Claims7
An integrated circuit package comprising a base substrate support member having an upper side and a lower side, said base substrate support member having a cavity in the upper side thereof and a cavity in the lower side thereof separated by a partition in said base substrate support member, a plurality of chips located in the cavity in the upper side of said base substrate support member, a plurality of chips located in the cavity in the lower side of said base substrate support member, said chips located in the cavity in the upper side of said base substrate support member having a back and being located in a back to back relationship and said chips located in the cavity in the lower side of said base substrate support member having a back and being located in a back to back relationship, said chips located in the cavity in the upper side of said base substrate support member being electrically connected to said chips located in the cavity in the lower side of said base substrate support member and means for closing the cavities in the upper and the lower sides of said base substrate support structure.
Dependencies are inferred from the claim text.