Burn-in apparatus and method for semiconductor devices
AssigneeSumitomo Electric Industries, Ltd.
InventorsTatsuya Hashinaga, Masanori Nishiguchi
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Abstract
A burn-in apparatus used in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. Also, the burn-in apparatus includes measuring devices for detecting electric characteristics of temperature sensors built in the respective semiconductor devices to individually measure junction temperatures of the semiconductor chips incorporated in the respective semiconductor devices, and laser beam irradiating mechanisms or electric heating members. The laser irradiating mechanisms or the heating members are controlled by control units, based on outputs of the measuring devices. Thus, the junction temperatures are maintained in a set junction temperature range, and the screening accuracy can be improved.
Claims20
A burn-in apparatus comprising:
- at least one burn-in board for mounting a plurality of semiconductor devices having semiconductor chips incorporated therein;
- a burn-in test chamber for accommodating said burn-in boards;
- measuring means for detecting electric characteristics of temperature sensors which are built in the respective semiconductor chips for individually determining junction temperatures of the semiconductor chips, and for generating signals corresponding to said junction temperatures;
- laser beam irradiating means provided in said burn-in test chamber for selectively irradiating a laser beam to the respective semiconductor devices which are mounted on said at least one burn-in board positioned in said burn-in test chamber, where said laser beam is irradiated based on a control signal;
- and
- control means for generating a control signal for said laser beam irradiating means based on outputs from said measuring means so that said laser beam irradiating means irradiates a laser beam to each semiconductor device which has a junction temperature below a predetermined temperature to maintain junction temperatures of the respective semiconductor devices in said predetermined junction temperature.
A burn-in method comprising the steps of:
- positioning at least one burn-in board having a plurality of semiconductor devices thereon in a burn-in test chamber, said semiconductor devices incorporating semiconductor chips with temperature sensors built in;
- detecting electric characteristics of said respective temperature sensors to individually determine junction temperatures of the semiconductor chips;
- and
- selectively heating the semiconductor chips by irradiating a laser beam onto the semiconductor chips having a junction temperature below a predetermined junction temperature so that measured values of the junction temperatures of the respective semiconductor chips are maintained in said predetermined junction temperature.
Dependencies are inferred from the claim text.