Integrated circuit device

An integrated circuit device comprising:

• a substrate;
• a plurality of integrated circuit elements formed on said substrate in matrix manner and insulated to each other by lattice shaped insulating belt portions, each of said integrated circuit elements including,
• an internal circuit for performing a predetermined
• a burn-in circuit for performing a burn-in process to said internal circuit when a burn-in control signal is supplied thereto, and
• at least two pads connected to each other and to said burn-in circuit for supplying said burn-in control signal to said burn-in circuit;
• and
• burn-in connecting lines extending across said insulating belt portions for electrically connecting one pad of one integrated circuit element to one pad of one of adjacent integrated circuit elements, and another pad of said one integrated circuit to one pad of another adjacent integrated circuit element, so that said one integrated circuit element is electrically connected to said one and another adjacent integrated circuit elements and said one and another adjacent integrated circuit elements are electrically connected to each other through said one integrated circuit element.