Grounding structure of a printed wiring board
AssigneeFujitsu Isotec Limited
InventorShinya Watanabe
Life of this patent
Estimating the term…
Abstract
At least one grounding through hole filled with solder is provided in a printed wiring board near by a fixing hole through which a screw fixes the board to a frame, penetrating a ground layer provided on an upper surface of the board and a substrate, made of insulating material, of the board. A metal layer made of electrically conductive and solderable material is plated on an inner surface of the grounding through hole so that melted solder is raised to an upper surface of the board. An upper end of the metal layer is formed to a flange electrically connected with the ground pattern so that the melted solder is raised from the upper surface of the board, forming a spherical end of the solder.
Claims5
A printed wiring board to be fixed to a frame by screws, including a substrate made of electrically insulating material and a ground pattern provided on an upper surface of the printed wiring board, said printed wiring board comprising:
- fixing holes provided by penetrating the printed wiring board through the ground pattern and the substrate, for making the screws fix the printed wiring board to the frame;
- and
- at least one grounding through hole provided near by at least one of said fixing holes by penetrating the printed wiring board through the ground pattern and the substrate, said grounding through hole being filled with solder so that the solder is electrically connected with the ground pattern and an upper surface of the solder filled in said ground through hole is raised from an upper surface of the printed wiring board so as to be touched with a head of the screw when the printed wiring board is fixed to the frame by the screw screwed through the fixing hole.
Dependencies are inferred from the claim text.