Mounting device for mounting an electronic device on a substrate by the surface mounting technology

An electronic circuit device, comprising:

• a substrate having upper and lower major surfaces, said substrate having a plurality of through holes defined therein to extend from the upper major surface to the lower major surface, and an interconnection pattern connected to the through holes;
• an electronic device having a plurality of interconnection pins for external connection;
• and
• a bracket including a plate member of an insulating material having upper and lower major surfaces, a plurality of counter-bores provided on the upper major surface of the plate member in correspondence to the plurality of interconnection pins of said electronic device, each of the counter-bores having a first diameter and a bottom surface at a level below the upper major surface of the plate member, a plurality of through-holes defined on the plate member in correspondence to each of the counter-bores, each of the through-holes being defined concentric to a counter-bore corresponding thereto and having a second diameter that is smaller than the first diameter, each of the through-holes extending from the bottom surface of the corresponding counter-bore to the bottom surface of the plate member, a plurality of solder pieces located in the plurality of counter-bores and holding means provided on the upper major surface of said plate member for holding said plurality of solder rings in said corresponding counter-bores such that said solder rings do not come off from said counter-bores,
• said electronic device being attached to said bracket by the interconnection pins that are inserted into the corresponding through-holes on the plate member,
• said bracket being attached to said substrate by the interconnection pins that are inserted into the corresponding through-holes on said substrate via the through-holes on the plate member,
• said electronic device and said bracket being connected to said substrate by reflowed solder pieces thereby connecting the interconnection pins to the interconnection pattern.

A method for mounting an electronic device having a plurality of interconnection pins on a substrate, comprising the steps of:

• selecting a bracket that incorporates a plate member of an insulating material having upper and lower major surfaces, a plurality of counter-bores provided on the upper major surface of the plate member in correspondence to the plurality of interconnection pins of the electronic device, each of the counter-bores having a first diameter and a bottom surface at a level below the upper major surface of the plate member, a plurality of through-holes defined on the plate member in correspondence to each of the counter-bores, each of the throughholes being further defined concentric to a counter-bore corresponding thereto and having a second diameter that is smaller than the first diameter, each of the through-holes extending from the bottom surface of the corresponding counter-bore to the bottom surface of the plate member, and a plurality of solder pieces provided on the plurality of counter-bores;
• providing holding means on the upper major surface of said plate member for holding said plurality of solder rings in said corresponding counter-bores such that said solder rings do not come off from said counter-bores;
• attaching the electronic device to the bracket, said step of attaching the electronic device to the bracket including a step of inserting the interconnection pins of the electronic device into corresponding through-holes on the plate member;
• attaching the electronic device and the bracket to which the electronic device is attached, to the substrate, the substrate having a plurality of through-holes and an interconnection pattern connected to the through-holes, said step of attaching the electronic device including a step of inserting the interconnection pins of the electronic device into the corresponding through-holes on the substrate via the through-holes on the plate member;
• and
• causing a reflowing of the solder ring by applying heat.