Molding materials based on unsaturated copolyamides

A process for producing structures, which comprises (1) molding a copolyamide molding material consisting essentially of:

• A) from 40 to 100% by weight of a copolyamide based on
• a.sub.1) from 1 to 20 mol%, based on the copolyamide, of at least one monomer that contains at least one olefinic doubles bond, selected from the group consisting of
• .alpha..sub.1) olefinically unsaturated lactams,
• .alpha..sub.2) olefinically unsaturated aminocarboxylic acids,
• .alpha..sub.3) olefinically unsaturated discarboxylic acids, and
• .alpha..sub.4) olefinically unsaturated diamines
• and
• a.sub.2) from 80 to 90 mol%, based on the copolyamide, of at least one monomer that contains no olefinic double bonds, selected from the group consisting of
• .beta..sub.1) lactams,
• .beta..sub.2) aminocarboxylic acids,
• .beta..sub.3) dicarboxylic acids, and
• .beta..sub.4) diamines
• and
• B) from 0 to 35% by weight of an impact modifying rubber,
• C) from 0 to 50% by weight of a filler or reinforcing agent,
• D) from 0 to 20% by weight of a flame retardant, and
• E) from 0 to 10% by weight of further additives and processing aids
• and (2) exposing the molded material to high-energy radiation.