Plated polyamide resin articles

Abstract

A plated polyamide resin article obtained by plating, with a suitable plating substance, a molded article of a polyamide resin composition is disclosed, the polyamide resin composition comprising (A) from 30 to 80% by weight of a polyamide resin, (B) from 20 to 70% by weight of a polyphenylene ether resin, (C) from 1 to 50 parts by weight, per 100 parts by weight of the sum of (A) and (B), of an impact modifier, and (D) from 0.01 to 30 parts by weight, per 100 parts by weight of the sum of (A) and (B), of a compatibilizer, in which the polyamide resin forms a continuous phase, and the polyphenylene ether resin forms a dispersed phase, with the polyamide resin having a crystallinity of from 20 to 55% with the crystalline region thereof being not less than 72% in the .gamma. crystal form. The plated article is excellent in heat resistance, impact resistance, and appearance.

Dependencies are inferred from the claim text.