Process for patterning layered thin films including a superconductor

Abstract

A process for patterning layered thin films comprising a bottom oxide superconductor (1) layer deposited on a substrate (3) and another thin film (2) deposited on the bottom superconductor layer and consisting of insulator, ordinary conductor or oxide superconductor having a different crystal orientation from the bottom superconductor layer. The bottom superconductor layer (1) is subjecting to heat-treatment before another thin film (2) is deposited thereon. The heat-treatment can be carried out under a first condition in ultra high-vacuum at a temperature which is lower than the oxygen-trap temperature (T.sub.trap) at which oxygen can enter into the oxide superconductor but is higher than a temperature which is lower by 100.degree. C. than the oxygen-trap temperature (T.sub.trap -100.degree. C.) or under a second condition in an atmosphere containing oxygen of high purity at a temperature which is higher than the oxygen-trap temperature (T.sub.trap) but is lower than a film forming temperature of the first thin film of oxide superconductor.

Dependencies are inferred from the claim text.