Circuit board
AssigneeKabushiki Kaisha Toshiba
InventorsKoji Yamakawa, Kaoru Koiwa, Takaaki Yasumoto, Kiyoshi Iyogi, Nobuo Iwase
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Abstract
A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
Claims18
A circuit board, comprising:
- a ceramic substrate;
- and
- a circuit pattern formed on said substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu and O to 5 atomic % of Ti, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.
Dependencies are inferred from the claim text.