Method for making electrostatic RF absorbant circuit carrier assembly

A method for providing a circuit carrier assembly comprising the steps of:

• forming a polymeric support structure having a base and surrounding walls which form an internal cavity;
• disposing a plurality of conductor paths disposed within the cavity;
• forming a polymeric cover having cover wall members integrally fashioned into a surface thereof, for making contact with conductor potential conductive paths within the cavity;
• depositing a layer of surface material on the cover and the cover wall members, said surface material comprising:
• a thermosetting binder,
• a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range of 1-60 GHz;
• and
• a conductive filler comprising 1 to 4 percent by weight loading of the thermosetting binder and the non-conductive RF absorbing filler for providing a surface resistivity between 10.sup.5 -10.sup.12 ohms/square, such that the surface material limits the electrostatic energy stored by the polymeric cover;
• and
• fixing the polymeric cover to the polymeric support structure to cover the cavity and provide said contact between the cover wall members and the ground potential conductive paths, thereby providing a circuit carrier assembly.