Metal mold device for molding a disc substrate
AssigneeSony Corporation
InventorsJunichiro Kudo, Jun Shimizu
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Corporation
InventorsJunichiro Kudo, Jun Shimizu
Estimating the term…
A metal mold device for molding a substrate includes a fixed metal mold, a movable metal mold mounted facing the fixed metal mold for being moved towards and away from the fixed metal mold and for defining a mold cavity between it and the fixed metal mold, a stamper mounted on at least one of the fixed metal mold or the movable metal mold and arranged within the mold cavity, a positioning unit provided on the metal mold on which the stamper is mounted for positioning the loading position of the stamper, and a stamper supporting unit provided on the metal mold on which the stamper is mounted for supporting the stamper by suction. The stamper is positioned by the positioning member and held under suction by the stamper suction unit so that it may be mounted in position on the fixed metal mold or the movable metal mold to permit a disc substrate to be molded highly accurately.
A metal mold device for molding a substrate having a projection, the projection being formed in a central portion of the substrate and having an opening, the device comprising:
A metal mold device for molding a substrate comprising:
A metal mold device for molding a disc substrate having a bottomed centering aperture and a reference loading plane for disc rotating and driving means, said reference loading plane being substantially parallel to the planar region on which a reproducing light beam is incident, said reference loading plane being projected from said planar region, comprising
Dependencies are inferred from the claim text.