US 5,326,035 AGranted

High purity cleaning system

AssigneeTadahiro Ohmi

InventorsTadahiro Ohmi, Michiya Kawakami, Yasuyuki Yagi, Makoto Ohwada, Kiyoshi Takahara

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Abstract

A method of cleaning under high temperature and high pressure and cleaning equipment to be used in a cleaning process now being employed in such industrial fields as the electronics industry centering around the semiconductor industry and the optical machine industry. The high temperature/high pressure cleaning equipment has at least a compressing pump, a heating device, a nozzle, and piping, and, in the cleaning equipment to inject high temperature/high pressure water from a nozzle to the matter to be cleaned, functions to inject high temperature/high pressure ultrapure water from the nozzle to the matter to be cleaned. Cleaning is carried out by injecting ultrapure water having a relative resistance of 17.0 M/l-cm or more when converted at 25.degree. C. to a matter to be cleaned.

Claims8

Dependent claims

A cleaning system for delivering a flow of ultrapure water to the surface of an object, comprising:

a source of ultrapure water;
a nozzle for delivering a flow of ultrapure water toward the surface of an object;
a conduit connecting said ultrapure water source to said nozzle in fluid communication with one another;
a heater attached to said conduit for heating the ultrapure water as it flows through said conduit;
and
a pump in fluid communication with said conduit for effecting a flow of ultrapure water from said source to said nozzle;
wherein each surface of the cleaning system over which the ultrapure water flows from said ultrapure water source to said nozzle comprises one of a metal and a metal alloy having a passivated film formed thereon, said film being formed by heating said surface in an ultrapure atmosphere and finishing said surface to a mirror-like state.

4 more elements

Dependencies are inferred from the claim text.