Method for removing electrical components from printed circuit boards

A method of removing a plurality of individual surface mounted electrical components from a printed circuit board retaining a plurality of other components, each of said individual components having a plurality of leads connected to circuitry on said board by a connection alloy comprising at least two constituent metals and having a given melting point less than that of either of said constituent metals, and comprising the steps of:

• obtaining a removal alloy comprising a plurality of constituent metals and having a particular melting point below said given melting point;
• heating said removal alloy to a temperature greater than said particular melting point but below said given melting point so as to produce a molten state thereof;
• sequentially contacting said connection alloy on each of said individual components with said molten removal alloy and causing thereby a reaction producing a molten state for said connection alloy;
• and
• sequentially separating said individual components from said printed circuit board while retaining thereon said other components.