Method of producing coaxial connections for an electronic component, and component package
AssigneeThomson-CSF
InventorChristian Val
Life of this patent
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Abstract
An object of the invention is the production of coaxial connections for the input/output links of the component and/or of the housing which encapsulates it. More precisely, the component placed in a package (B), is conventionally connected by wires to its package; the wires are next covered by a first insulating layer (21) then by a second conducting layer (24) in such a way that this second layer is linked to the earth pads (P.sub.E1) of the package. The layers (21, 24) thus form collectively-produced coaxial structures with the connection wires (F). A similar process is used for the input/output connections (P) of the package itself.
Claims10
Method of producing connections for an electronic component (Cl) placed on a base (E) of a package (B), the base (E) further comprising input-output connection pins (P), the method being characterised in that it successively comprises the following steps:
- a first step of electrical linking of each pad (P.sub.Cl) of the component (Cl) to a pad (P.sub.E2) of the base (E) by means of a wire (F);
- a second step of depositing a layer (21;
- 41) of an electrically-insulating material on the wires (F) and at least those of the pads (P.sub.E2) of the base to which the wires are linked, and/or on the pins (P) of the package;
- a third step of depositing a layer (24;
- 42) of electrically-conducting material on the part of the insulating layer which covers the wires (F) and/or the pins (P), the conducting layer being linked to a reference potential, the said insulating and conducting layers thus forming with the wires and/or the pins coaxial-structure electrical connections.
A package comprising a base (E) bearing an electronic component (C1) and a cap (C) arranged on a base, with pads (P.sub.C1) of the component being connected to pads (P.sub.E2) of the base by conducting wires (F);
- the package being characterized in that the wires are covered by a layer (21) of an insulating material and the latter by a layer (24) of a conducting material, the conducting layer being linked to a reference potential, and the electrical connections of the component to the base thus having a coaxial structure.
A package comprising a base (E) bearing an electronic component (C1), a cap (C) arranged on the base and having input-output connection pins (P);
- the package being characterized in that the pins are covered by a layer (41) of an insulating material and the latter by a layer (42) of a conducting material, the conducting layer being linked to a reference potential, and the connection pins of the package thus having a coaxial structure.
Dependencies are inferred from the claim text.