Process for forming polyimide-metal laminates
AssigneePolyonics Corporation
InventorsPhilip D. Knudsen, Daniel P. Walsh
Life of this patent
Estimating the term…
Abstract
Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.
Claims3
A laminate product which comprises a polyetherimide sheet having at least one through-hole extending between two surfaces of said sheet, said surfaces of said sheet and the surfaces of said through-hole being uniformly and completely hydrophilized, said polyetherimide sheet surfaces and the surfaces of said at least one through-hole being free of an adhesive and having a metal coating comprising an electroless nickel or cobalt coating and an electrolytic copper coating bonded to each of said nickel or cobalt coatings, said laminate sheet product having a peel strength of at least 6.0 lb./in. as measured by IPC test 2.4.9 Method A and a peel strength of at least 4.5 lb./in. as measured by IPC test 2.4.13 for solder float.
The product of any one of claims 1 or 3 wherein each of said metal coating on said polyetherimide sheet including copper is patterned.
Dependencies are inferred from the claim text.