Multi-chip module testing
AssigneeTexas Instruments Incorporated
InventorsSteve E. Sparks, Darvin R. Edwards, Katherine G. Heinen
Life of this patent
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Abstract
A base for a multi-chip module that provides for built-in testability. Active test components are embedded in a module substrate. These test components primarily consist of boundary scan cells that comply with the IEEE 1149.1 test standard. The scan cells are connected to each other, and are connected to interconnection paths among chips and to individual chips, thereby partitioning the module into testable partitions. These partitions permit testing of chip interconnections, chip functionality, and module functionality. Scan cell connections may be mask programmable so that the same multi-chip module base can be used for many different multi-chip module configurations.
Claims15
A multi-chip module base, upon which a number of chips and other functional elements are to be interconnected, comprising:
- a substrate comprised of a semiconductor material;
- an array of substantially identical boundary scan test circuits embedded within said substrate;
- input and output connectors in said substrate for connecting said test circuits to selected points of functional elements of said module;
- and
- connectors embedded within said substrate inter-connecting said test circuits to each other in a configuration that permits simultaneous pre-testing of all the test circuits in the substrate prior to mounting module chips, and to said input and output connectors in accordance with boundary scan techniques.
Dependencies are inferred from the claim text.