Printed circuit board for an injection molding apparatus

An injection molding apparatus comprising:

• a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles;
• at least one printed circuit board, associated with the mold manifold plate;
• a power source;
• wherein the at least one printed circuit board electrically connects the power source with the housing heaters;
• wherein the mold manifold plate has a front face, the at least one printed circuit board being mounted to the front face of the mold manifold plate whereby the at least one printed circuit board is servicable without disassembling the injection molding apparatus;
• and
• wherein the mold manifold plate has at least one circuit board channel formed in the front face, the at least one printed circuit board being mounted in the at least one circuit board channel.

An injection molding apparatus, comprising:

• a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles;
• at least one printed circuit board, associated with the mold manifold plate;
• a power source;
• wherein the at least one printed circuit board electrically connects the power source with the housing heaters;
• wherein each nozzle of the plurality of injection molding nozzles has a respective housing heater and further has a respective temperature sensing means whereby the temperature of each nozzle is monitored;
• and
• wherein the at least one printed circuit board comprises at least one power layer printed with a plurality of power supply tracks and at least one sensor layer printed with a plurality of sensor tracks, each power supply track being connected at a first end to the power source and at a second end to a respective housing heater, each sensor track being connected at a first end to a respective one of said temperature sensing means, and at a second end to a controlling means for receiving input from sensor tracks and controlling power supplied to said power supply tracks.

An injection molding apparatus comprising:

• a plurality of injection molding nozzles for injection molding molten plastic material;
• a plurality of heaters associated with the plurality of injection molding nozzles for heating the plurality of injection molding nozzles and the molten plastic material therein;
• a power source for the plurality of heaters;
• at least one printed circuit board associated with the power source and the plurality of heaters and electrically connecting the power source with the plurality of heaters;
• and
• wherein the at least one printed circuit board includes at least one power layer printed thereon with at least one power supply track, the at least one power supply track being connected at a first location to the power source and at a second location to a respective heater.

An injection molding apparatus comprising:

• a plurality of injection molding nozzles for injection molding molten plastic material;
• a plurality of heaters associated with the plurality of injection molding nozzles for heating the plurality of injection molding nozzles and the molten plastic material therein;
• a power source for the plurality of heaters;
• a temperature sensing means for each nozzle whereby the temperature of each nozzle is monitored;
• and
• at least one printed circuit board associated with the temperature sensing means, said printed circuit board including at least one sensor layer printed with a plurality of sensor tracks, each sensor track being connected at a first location to a respective one of said temperature sensing means and at a second location to a controlling means for receiving input from the sensor tracks.