Multilayer ceramic chip capacitor

A multilayer ceramic chip capacitor which is prepared by successively layering and co-firing a dielectric material having additives added to a matrix of the following formula:

• [(Ba.sub.1-x-y Ca.sub.x Sr.sub.y)O].sub.m (Ti.sub.1-z Zr.sub.z)O.sub.2
• wherein 0.ltoreq.x.ltoreq.0.25, 0.ltoreq.y.ltoreq.0.05, 0.1.ltoreq.z.ltoreq.0.3, and 1.000.ltoreq.m.ltoreq.1.020, said additives including an oxide of Mn and/or a compound which converts to the oxide upon firing, an oxide of Y and/or a compound which converts to the oxide upon firing, an oxide of V and/or a compound which converts to the oxide upon firing, and an oxide of W and/or a compound which converts to the oxide upon firing, and an internal electrode-forming material in the form of Ni or a Ni alloy, wherein said additive powders have a mean particle size of up to 3 .mu.m.

A multilayer ceramic chip capacitor which is prepared by successively layering and co-firing a dielectric material having additives added to a matrix of the following formula:

• [(Ba.sub.1-x-y Ca.sub.x Sr.sub.y)O].sub.m (Ti.sub.1-z Zr.sub.z)O.sub.2
• wherein 0.ltoreq.x.ltoreq.0.25, 0.ltoreq.y.ltoreq.0.05, 0.1.ltoreq.z.ltoreq.0.3, and 1.000.ltoreq.m.ltoreq.1.020, said additives including an oxide of Mn and/or a compound which converts to the oxide upon firing, an oxide of Y and/or a compound which converts to the oxide upon firing, an oxide of V and/or a compound which converts to the oxide upon firing, an oxide of W and/or a compound which converts to the oxide upon firing, and Al.sub.2 O.sub.3 sintering aid, and an internal electrode-forming material in the form of Ni or a Ni alloy.