Plated compliant lead
AssigneeComputing Devices International, Inc.
InventorsDeepak K. Pai, Terrance A. Krinke
Life of this patent
Estimating the term…
Abstract
A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.
Claims21
A system for mounting at least one integrated circuit chip in spaced relation to a circuit board and for providing electrical contact between circuit contacts associated with the chip and board contacts on the circuit board, the system comprising:
- a plurality of curved leads for providing a resilient connection between the board contacts and the circuit contacts, each curved lead being substantially entirely coated with solder plating in a range of 0.3 mils to 1.5 mils thick, and each curved lead being formed of a single piece of conductive material including:
- a first leg having a first surface for connection to a circuit contact;
- and
- a second leg generally parallel to the first leg and joined to the first leg by at least one curved portion, the second leg having a second surface for connection to a board contact.
An apparatus for providing a mechanical connection and an electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip, the apparatus comprising:
- a curved lead substantially entirely plated with solder plating in a range of 0.3 mils to 1.5 mils thick and being formed of a single piece of conductive material having a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact, the first and second surfaces being connected by at least one curved portion, the first and second surfaces being arranged to mount the circuit chip to the circuit board with the solder plating in a compliant, generally flat arrangement substantially free of stress.
Dependencies are inferred from the claim text.