Hermetic sealing of flexprint electronic packages

A method for providing a hermetically sealed electronics package comprising the steps of:

• locating electronic element means defining at least one electronic element and cavity means defining at least one cavity in a flexprint;
• an electronic element support secured to said flexprint and underlying at least said electronic element cavity means;
• positioning a deformation resistant frame structure above the cavity means and the electronic element means therein, and on the flexprint;
• positioning a cover over the frame structure and the electronic element means;
• and
• hermetically sealing the cover to the flexprint to provide a hermetically sealed electronic element means and flexprint package.

A hermetically sealed electronics package comprising:

• a flexprint comprising a plurality of layers and having cavity means therein defining at least one cavity;
• an electronic element support secured to said flexprint and underlying said cavity means;
• cooling means cooling an electronic element and the cooling means secured below said electronic element support;
• electronic element means defining at least one electronic element having electrical connections to said flexprint, said electronic element means being located in said cavity means and on and supported by said electronic element support;
• a rigid frame structure extending above said electrical connections, said cavity means and said electronic element means therein, said frame structure having a base which is located on said flexprint;
• and
• a cover located on said frame structure and also extending above said electrical connections, said cavity means and said electronic element means therein, said cover also having a base which is hermetically sealed to said flexprint to provide hermetic sealing of said cavity means and said electronic element means therein.