Device with flexible, stripline conductors and a method of manufacturing such a device

A device with bandshaped conductors enclosed by a dielectric two large surfaces of said bandshaped conductors surrounded by ground planes, wherein

• a conductor laminate is arranged comprising
• first dielectric substrate,
• said bandshaped conductors being located on a first surface of said first dielectric substrate,
• at each side of a considered length of each of said bandshaped conductors there is an edge extending substantially in parallel with said conductor of said first dielectric substrate and an edge of a window opening through the thickness of said first dielectric substrate,
• a ground plane laminate is arranged comprising
• a second substrate, having edges, being cut similarly to said first dielectric substrate including window openings coinciding with said window openings of said first dielectric substrate and
• a first conductive layer located on a first side of said second substrate,
• wherein said conductor laminate and ground plate laminate are attached to each other with said bandshaped conductors of the conductor laminate applied to said second side of said second substrate of said ground plane laminate, which is not coated with said first conductive layer, and
• wherein a second conductive layer is located on a side of the device, which is opposite to said first side of the ground plane laminate having said first conductive layer, said second conductive layer extending over the edges of said first and second substrates, also inside said window openings to be electrically connected to edges of first conductive layer located on said second substrate, such that said bandshaped conductors and said substrates are completely enclosed by an electrically conductive layer.

A method for the manufacture of a device with bandshaped conductors enclosed by a dielectric and a large surface of said bandshaped conductors surrounded by ground plane, comprising the steps of:

• forming a conductor laminate comprising a first dielectric substrate, wherein bandshaped conductors on one of said conductor laminate sides is given a desired shape,
• forming window openings in said first substrate between said bandshaped conductors,
• forming a second dielectric substrate similar in shape as said first substrate,
• forming window openings in said second substrate, which essentially coincide in shape and location with said window openings in said first substrate,
• coating said second substrate with a first conductive layer on one of said second substrates' sides in order to form a ground plane laminate,
• attaching said conductor laminate and said ground plane laminate to each other by adhesive bonding, with said bandshaped conductors of said conductor laminate being applied to a side of the ground plane laminate which is not coated with said first conductive layer, and
• coating another side of the device, which is opposite to said conductive surface of said ground plane laminate, edges of said laminates, and edges inside said window openings to be electrically connected to said conductive layer on said ground plane laminate with a second conductive layer, so that said bandshaped conductors, said first dielectric substrate, and said second substrate are enclosed by an electrically conductive layer.