Burn-in apparatus and burn-in board removing method using movable cooling enclosure
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorIwao Sakai
Life of this patent
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Abstract
A burn-in apparatus includes a robot for supplying and removing burn-in boards. The robot includes a movable enclosure capable of temperature control. In a burn-in board removing method, a burn-in board which is to be removed from the chamber of a burn-in apparatus body is enclosed by the movable enclosure of the robot. The interior of the movable enclosure is then cooled to normal temperatures by means of a cooling mechanism. Subsequently, power supply to semiconductor IC's on the burn-in board is suspended, and the burn-in board is removed. In this way, disappearance of failures generated by the charging-up during the burn-in can be prevented, and a burn-in test can be accurately conducted.
Claims11
A burn-in apparatus comprising:
- a burn-in apparatus body having a burn-in chamber in which burn-in boards are heated and subjected to a burn-in test;
- and
- a robot for supplying a burn-in boards into and removing the burn-in boards from the burn-in chamber, the robot comprising:
- a movable enclosure movable between a position outside of the burn-in chamber and a position inside the burn-in chamber in which the movable enclosure surrounds a burn-in board disposed inside the burn-in chamber;
- and
- a cooling means for cooling the inside of the movable enclosure while the movable enclosure is disposed inside the burn-in chamber.
A method of removing a burn-in board from a burn-in apparatus comprising the steps of:
- enclosing a burn-in board accommodated in a burn-in chamber of a burn-in board apparatus with a movable enclosure after a semiconductor IC on the burn-in board has been subjected to burn-in and while the burn-in board is at a first temperature above normal temperature and electric power is being supplied to the IC;
- cooling the inside of the movable enclosure to a second temperature below the first temperature;
- suspending the supply of power to the semiconductor IC on the burn-in board after the inside of the movable enclosure reaches the second temperature;
- and
- removing the burn-in board from within the burn-in chamber.
A burn-in apparatus comprising:
- a burn-in apparatus body having a burn-in chamber for accommodating a plurality of burn-in boards;
- and
- a robot for supplying burn-in boards into and removing burn-in boards from the burn-in chamber, the robot comprising:
- a movable enclosure movable between a position outside of the burn-in chamber and a position inside the burn-in chamber in which the movable enclosure surrounds a plurality of burn-in boards disposed inside the burn-in chamber such that the temperature of burn-in boards surrounded by the enclosure within the burn-in chamber can be different from the temperature of portions of the burn-in chamber outside the enclosure.
A method of removing a burn-in board from a burn-in apparatus comprising:
- enclosing a burn-in board accommodated in a burn-in chamber of a burn-in apparatus with a movable enclosure;
- cooling the burn-in board enclosed by the movable enclosure to a temperature lower than the inside of the burn-in chamber surrounding the movable enclosure;
- and
- removing the burn-in board from the burn-in chamber.
A method of removing a burn-in board from a burn-in apparatus comprising:
- enclosing a burn-in board accommodated in a burn-in chamber of a burn-in apparatus with a movable enclosure comprising an inner portion surrounding the burn-in board and an outer portion surrounding the inner portion;
- cooling the inside of the movable enclosure to a temperature lower than the temperature inside the burn-in chamber surrounding the movable enclosure;
- removing the burn-in board and the inner portion of the movable enclosure from the burn-in chamber;
- raising the temperature of the inside of the outer portion of the movable enclosure to substantially the same temperature as the inside of the burn-in chamber;
- and
- removing the outer portion of the movable enclosure from the burn-in chamber.
Dependencies are inferred from the claim text.