Shielded stripline configuration semiconductor device and method for making the same

A shielded stripline configuration semiconductor device comprising:

• a semiconductor die having a ground power supply terminal on an active surface, the ground power supply terminal being electrically connected to a backside of the semiconductor die;
• a leadframe having a ground lead, the leadframe being electrically connected to the semiconductor die wherein the ground lead is electrically connected to the ground power supply terminal;
• a metal base upon which the semiconductor die is directly mounted with an electrically conductive adhesive to electrically connect the metal base to the ground power supply terminal;
• a metal lid electrically connected to the ground lead by a connection external to the metal lid;
• and
• an electrically insulating adhesive means for sealing the metal base and lid, wherein the semiconductor die and leadframe are disposed between the metal base and lid, such that the metal base and lid form a protective package body around the semiconductor die and a portion of the leadframe.

A method for making a shielded stripline configuration semiconductor device comprising the steps of:

• providing a semiconductor die having a power supply terminal on an active surface;
• providing a leadframe having a plurality of leads;
• electrically connecting the semiconductor die to the plurality of leads of the leadframe;
• mounting the semiconductor die directly onto a metal base with an adhesive;
• electrically connecting the metal base to the power supply terminal of the semiconductor die;
• providing a metal lid;
• sealing the metal base and lid with an electrically insulating adhesive, wherein the semiconductor die and leadframe are disposed between the metal base and lid, such that the metal base and lid form a protective package body around the semiconductor die and a portion of the leadframe;
• and
• electrically connecting the metal lid to the power supply terminal of the semiconductor die with a connection external to the package body.

A shielded stripline configuration semiconductor device comprising:

• a semiconductor die having a power supply terminal on an active surface;
• a leadframe having a plurality of leads which are electrically connected to the semiconductor die, wherein the plurality of leads of the leadframe comprise a ground lead which is electrically connected to the power supply terminal of the semiconductor die;
• a metal base upon which the semiconductor die is directly mounted with an adhesive;
• a metal lid electrically connected to the power supply terminal of the semiconductor die by an external wire bond extending from the metal lid to the ground lead;
• means for electrically connecting the metal base to the power supply terminal;
• and
• electrically insulating adhesive means for sealing the metal base and lid, wherein the semiconductor die and leadframe are disposed between the metal base and lid, such that the metal base and lid form a protective package body around the semiconductor die and a portion of the leadframe.