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US 5,317,006 AGranted
Cylindrical magnetron sputtering system
AssigneeMicroelectronics and Computer Technology Corporation
InventorNalin Kumar
Life of this patent
Estimating the term…
Abstract
An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other characteristics which enhance the ability of the sputtering system to deposit films of high temperature superconductor material on substrates.
Claims12
A cathode for inclusion in a sputtering system, said cathode comprising:
- a metallic outer cylinder and
- lengthwise arrayed target material disposed within said metallic outer cylindrical in a closed polygonal cross-sectional shape within said metallic outer cylinder, said lengthwise arrayed target material able to be sputtered and to thereby form a film of high temperature superconducting material on a substrate positioned within said closed polygonal shape.
A system for depositing a superconducting film on at least one substrate, said system comprising:
- a sputtering system including a cathode comprising a metallic outer cylinder and lengthwise arrayed target material disposed within said metallic outer cylinder so as to form a closed, polygonal cross-sectional shape within said metallic outer cylinder;
- and
- means for causing at least one substrate to move through said sputtering system.
Dependencies are inferred from the claim text.