Semiconductor apparatus of module installing type

A semiconductor apparatus of a module installing type having a plurality of semiconductor integrated circuit devices mounted thereon and having different heat generation amounts, comprising:

• a printed circuit board made of resin and having at least one through hole;
• a plurality of first semiconductor integrated circuit devices mounted on said printed circuit board and having a maximum heat generation amount of less than 5 W, each of said plurality of first semiconductor integrated circuit devices having input terminals and output terminals;
• a heat diffusing plate made of metal or ceramics;
• and
• at least one second semiconductor integrated circuit device arranged in the through hole of said printed circuit board and also mounted on said heat diffusing plate, each of said at least one second semiconductor integrated circuit device having signal input terminals and output terminals and having a heat generation amount of 5 W or more,
• wherein signal input terminals and output terminals of said second semiconductor integrated circuit device are electrically connected to signal input terminals and output terminals of at least one of said first semiconductor integrated circuit devices,
• wherein said heat diffusion plate has radiating fins provided thereon, which extend externally of said printed circuit board, and
• wherein said printed circuit board is provided with external input and output terminals.