US 5,315,481 A · Packaging construction for semiconductor wafers

Abstract

The present invention resides in a packaging construction for removably mounting and interconnecting semiconductor wafers with minimized interconnection lead lengths between the wafers and with a high packing density. The wafer packaging construction includes a multilayer printed circuit board, an insulating board interposed between each wafer and the circuit board and upper and lower housing sections. Electrical connections between contact areas on each semiconductor wafer and the multilayer circuit board are established by compressing the housing sections together, thus compressing wadded-wire connector elements positioned in openings of the insulating boards against the wafer contact areas and the multilayer circuit board contact areas. The novel construction of the invention eliminates the need for soldering, removes the interconnect inductance of the fine wires used in conventional packaging constructions, dramatically increases the number of wafers that can be mounted on a single multilayer circuit board, and substantially reduces signal propagation time between circuits.

Claims12

Dependent claims

A semiconductor wafer packaging construction, comprising:

at least one semiconductor wafer, wherein each semiconductor wafer has a plurality of integrated circuits therein covering substantially the entire wafer and a plurality of contact areas;
at least one insulating board, wherein each insulating board has a plurality of openings therethrough, with at least some of the openings at positions corresponding to the wafer contact areas;
a circuit board having contact areas at positions corresponding to some of the insulating board openings;
a plurality of conductive connector elements disposed in selected ones of the openings in each insulating board, each of said connector elements including a wadded strand of conductive wire that is deformed when compressed;
and
means for compressing each wafer toward the circuit board, thereby compressing the wadded strand of each of the connector, each strand elements making multiple electrical contact between a corresponding wafer contact area and a circuit board contact area;
wherein the packaging construction is a wafer scale integrated circuit packaging construction.

4 more elements

Dependencies are inferred from the claim text.

Packaging construction for semiconductor wafers

Life of this patent

Packaging construction for semiconductor wafers

Life of this patent

Abstract

Claims12