US 5,315,472 AGranted

Ground ring/spark gap ESD protection of tab circuits

AssigneeHewlett-Packard Company

InventorsJon J. Fong, William B. Reid

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Abstract

An electrostatic discharge structure protection structure formed on an interconnect circuit (20) that includes elongated interconnect lines (13) and interconnect contact pads (17) formed on a dielectric substrate (11) wherein portions of the interconnect circuit are subject to physical contact by a person. The electrostatic discharge protection structure includes an interconnected conductive grounding metallization ground pattern that includes a ground ring pattern (19) adjacent selected edges of the perimeter of the substrate and conductive metallization traces (29) adjacent selected edges of openings in the substrate. The electrostatic discharge protection structure further includes spark gaps (23a, 23b) formed between the interconnect pads and the conductive grounding pattern, and grounding pads (25') exposed by openings in the substrate.

Claims5

Dependent claims

An electrostatic discharge protection structure formed on an interconnect circuit structure that includes a dielectric substrate having a printed side and a non-printed side and a pattern of openings formed therein, and elongated interconnect lines and interconnect contact pads formed on the printed side of the dielectric substrate, wherein the interconnect contact pads are formed over corresponding openings in the dielectric substrate so that the interconnect contact pads are contacted from the non-printed side through the corresponding openings, the electrostatic discharge protection structure comprising:

perimeter conductive grounding means formed on the printed side of the dielectric substrate adjacent selected edges of the perimeter of the substrate and surrounding the area occupied by the elongated interconnect lines and interconnect contact pads, said conductive grounding means being conductively connected to a ground reference;
interior conductive grounding means formed on the printed side of the dielectric substrate adjacent selected edges of openings in the substrate and conductively connected to said perimeter conductive grounding means;
conductive grounding pads formed on the printed side of the dielectric substrate over openings in the substrate so as to be subject to contact by a person from the non-printed side of the dielectric substrate and located adjacent selected interconnect pads and electrically connected to said perimeter conductive grounding means;
spark gaps formed on the printed side of the dielectric substrate between said perimeter conductive grounding means and selected ones of said interconnect contact pads which are adjacent said perimeter conductive grounding means;
spark gaps formed on the printed side of the dielectric substrate between said conductive grounding pads and said adjacent selected interconnect pads;
and
spark gaps formed on the printed side of the dielectric substrate between adjacent interconnect contact pads such that discharge paths to the perimeter conductive grounding means are provided for each of the interconnect contact pads.

4 more elements

perimeter conductive grounding means formed on the printed side of the dielectric substrate adjacent selected edges of the perimeter of the substrate and surrounding the area occupied by the elongated interconnect lines and interconnect contact pads, said conductive grounding areas being conductively connected to a ground reference;
interior conductive grounding means formed on the printed side of the dielectric substrate adjacent selected edges of openings in the substrate and conductively connected to said perimeter conductive grounding means;
conductive grounding pads formed on the printed side of the dielectric substrate over openings in the substrate so as to be subject to contact by a person from the non-printed side of the dielectric substrate and located adjacent interconnect pads which are not adjacent said perimeter grounding means and electrically connected to said perimeter conductive grounding means;
spark gaps formed on the printed side of the dielectric substrate between said perimeter conductive grounding means and interconnect contact pads adjacent said perimeter grounding pattern;
and
spark gaps formed on the printed side of the dielectric substrate between said conductive grounding pads and said adjacent selected interconnect pads;
so that spark gaps are formed on the printed side of the dielectric substrate between each interconnect pad and either (a) the perimeter grounding means or (b) a conductive element that is conductively connected to said perimeter grounding means.

4 more elements

Dependencies are inferred from the claim text.