US 5,315,241 A · Method for testing integrated circuits

Abstract

A substrate is provided as a test fixture for burning-in and testing integrated circuit devices. The substrate contains a plurality of unpackaged integrated circuit dice arranged in a regular matrix of rows and columns. The substrate is partitioned into an array of rectangles which can be easily broken apart. One integrated circuit die is attached in each rectangle. The integrated circuits are bonded to conductive traces in their respective rectangular areas, and the conductive traces are connected to common locations at one side of the substrate. Voltages can be applied to all of the devices simultaneously by contacting the common locations at the edge of the substrate. This allows for burn-in of all integrated circuit devices on the substrate in parallel, after which they can be separated and used individually on printed circuit boards.

Claims20

Dependent claims

A method for testing integrated circuit devices, comprising the steps of:

attaching a plurality of integrated circuit dice, containing a desired plurality of devices, to an insulating substrate having conductive traces on an upper surface and a lower surface thereof,
wherein said insulating substrate is divided into a plurality of regions defined by multiple lines of conductive through holes therethrough,
and wherein said conductive traces on said upper surface are electrically connected to said conductive traces on said lower surface through said through holes;
wire bonding to connect bonding wires from conductive bond pads on said integrated circuit dice to corresponding bonding locations on said traces on said upper surface;
providing electrical power and signals to said integrated circuit dice through said conductive traces on said lower surface, wherein the signals are connected to said integrated circuit dice through said through holes, said conductive traces on said upper surface, and said bonding wires, for at least a predetermined burn-in period;
physically breaking said conductive traces to at least partially isolate said integrated circuit dice;
and
testing said integrated circuit dice.

5 more elements

Dependencies are inferred from the claim text.

Method for testing integrated circuits

Life of this patent

Method for testing integrated circuits

Life of this patent

Abstract

Claims20