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US 5,315,155 AGranted
Electronic package with stress relief channel
AssigneeOlin Corporation
InventorsBrian E. O'Donnelly, Brian Mravic, Jacob Crane, Deepak Mahulikar
Life of this patent
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Abstract
There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
Claims12
An electronic package assembly, comprising:
- a leadframe having a plurality of leads, the inner ends of which define a central region;
- a base containing a recessed channel defining a pedestal disposed adjacent said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel;
- a buffer bonded to said pedestal with a portion of said buffer overhanging said pedestal;
- and
- a sealing glass bonding said base to said leadframe.
2 more elements
An electronic package assembly, comprising:
- a leadframe having a plurality of leads, the inner ends of which define a central region;
- a metallic base containing a recessed channel forming a pedestal disposed within said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel;
- a buffer brazed to said pedestal with a portion of said buffer overhanging said pedestal;
- and
- a sealing glass bonding said base to said leadframe.
2 more elements
Dependencies are inferred from the claim text.