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US 5,315,140 AGranted
Semiconductor device having a polysilicon capacitor with large grain diameter
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKazuyuki Sugahara, Hideaki Arima
Life of this patent
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Abstract
A semiconductor device includes a capacitor with an insulator having an improved durability. In the semiconductor device, a capacitor lower electrode 11 of the cylindrical capacitor includes a standing wall portion 11b which is formed of a polysilicon layer having a large crystal grain diameter (1000.ANG.-10000.ANG.).
Claims9
A semiconductor device, comprising:
- a semiconductor substrate of a second conductivity type having a major surface and an impurity region of a first conductivity type located in said major surface;
- an insulating layer formed on said major surface of said semiconductor substrate and having an opening reaching said impurity region;
- a capacitor lower electrode having a first portion, which is in contact with a surface of said impurity region and a surface of said insulating layer and is formed of silicon crystal having a first grain diameter, and a second portion, which is in contact with at least an outermost edge of said first portion, extends upwardly from said major surface of said semiconductor substrate and is formed of silicon crystal having a second grain diameter larger than said first grain diameter;
- a capacitor insulating layer covering the surface of said capacitor lower electrode;
- and
- a capacitor upper electrode covering the surface of said capacitor insulating layer.
3 more elements
A semiconductor device, comprising:
- a semiconductor substrate of a second conductivity type having a major surface and an impurity region of a first conductivity type located in said major surface;
- an insulating layer formed on said major surface of said semiconductor substrate and having an opening reaching said impurity region;
- a capacitor lower electrode having a first portion, which is in contact with a surface of said impurity region and a surface of said insulating layer, and a second portion, which is in contact with at least an outermost edge of said first portion and extends upwardly from said major surface of said semiconductor substrate;
- a capacitor insulating layer covering the surface of said capacitor lower electrode;
- and
- a capacitor upper electrode covering the surface of said capacitor insulating layer, wherein
- said second portion comprises a lower part located on an upper surface of said outermost edge of said first portion and having a thickness along said major surface of said semiconductor substrate gradually increasing downward, and a higher part having a substantially uniform thickness.
4 more elements
Dependencies are inferred from the claim text.