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US 5,314,984 AGranted
Heat resistant resin compositions, articles and method
AssigneeGeneral Electric Company
InventorsMark Markovitz, Jeffrey D. Sheaffer
Life of this patent
Estimating the term…
Abstract
Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.
Claims11
A solventless, vacuum-pressure impregnatable thermosetting resin composition having viscosity less than 4,500 cps at 25.degree. C. and unique thermal stability consisting essentially of
- (a) an epoxy resin composition consisting essentially of a nitrogen-free 1,2 epoxy resin having a least two epoxide groups per molecule, a small but effective amount of a phenolic accelerator and a labile halogen-free cationic catalytic hardener selected from the group consisting of a metal acetylacetonate and an organic titanate in an amount on the basis of the epoxy resin between 0.1 and 15% of the acetylacetonate and between 0.025 and 10% of the organic titanate;
- (b) a bismaleimide resin composition;
- and,
- (c) aryl vinyl monomer as reactive diluent.
1 more element
Dependencies are inferred from the claim text.