Resin-sealed type semiconductor device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsHiromichi Sawaya, Toshio Ishigami
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Abstract
A resin-sealed type semiconductor device comprises a lead frame having a bed and external leads, a semiconductor element mounted on the bed and having electrodes, a fine metal wire for making an electrical connection between the electrode and the lead frame, a resin layer which seals the semiconductor element, fine metal wire and portion of the lead frame therein and a recess formed at a central portion of one surface side of the resin layer and having a controlled depth, whereby the development of cracks in the resin layer as caused by heat load is prevented.
Claims4
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of:
- preparing a lead frame having a bed and external leads,
- mounting a semiconductor element on the bed, said semiconductor element having at least one electrode;
- electrically connecting the lead frame to the electrode by a fine metal wire;
- fixedly sealing said semiconductor element, said fine metal wire and a portion of said lead frame with a resin layer formed in a mold;
- and
- forming a recess having a controlled depth of about 60 .mu.m or less in the resin layer by knocking the resin layer out of the mold with an ejector pin, the controlled depth being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during a subsequent soldering process.
A method for manufacturing a resin-sealed type semiconductor device, comprising the steps of:
- preparing a lead frame having a bed and external leads;
- mounting a semiconductor element on the bed, the semiconductor element having at least one electrode;
- electrically connecting the lead frame to the electrode by a fine metal wire;
- fixedly sealing the semiconductor element, fine metal wire and a portion of the lead frame with a resin layer formed in a mold;
- forming a recess having a controlled depth of about 60 .mu.m or less in the resin layer by knocking the resin layer out of the mold with an ejector pin;
- temporarily fixing the resin layer to a mount substrate by coating a bond material near the recess;
- and
- fixedly soldering the external lead to the substrate, the controlled depth of the recess being sufficiently shallow to substantially prevent cracks from occurring in the bottom of the recess during the soldering step.
Dependencies are inferred from the claim text.