Resin impregnated laminate for wiring board applications
AssigneeE. I. Du Pont de Nemours and Company
InventorsBirol Kirayoglu, William J. Sillivan, Melvin P. Zussman
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Abstract
Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.
Claims4
Nonwoven aramid sheet useful as reinforcement in electronic printed wiring board laminates having a coefficient of thermal expansion of less than 10 ppm per .degree. C., said sheet comprised of from 5 to 25 weight percent poly(m-phenylene isophthalamide) fibrids and 75 to 95 weight percent p-aramid floc and having a basis weight of between 0.8 and 4.0 oz/yd.sup.2 and a density between 0.5 and 1.0 g/cc and a Gurley Hill Porosity of less than 10 seconds.
Dependencies are inferred from the claim text.