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US 5,314,720 AGranted
Cure inhibited epoxy resin compositions and laminates prepared from the compositions
AssigneeThe Dow Chemical Company
InventorsJoseph Gan, James L. Bertram
Life of this patent
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Abstract
In summary, the invention is related to the discovery of a class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures. More particularly the invention relates to an epoxy resin composition comprising a) a polyepoxide; and b) a cure inhibitor comprising boric acid.
Claims10
A process for coating an epoxy resin composition on a reinforcing material comprising contacting a reinforcing material with an intimately mixed composition comprising
- i) a polyepoxide;
- ii) a curing agent which does not contain phenolic hydroxyl moieties;
- iii) cure inhibitor comprising boric acid;
- and
- iv) a compound which catalyzes the curing of the polyepoxide with the curing agent;
- and
- wherein said curing agent is employed in an amount of from about 0.5 to about 30 parts per 100 parts of said polyepoxide.
4 more elements
A partially cured epoxy resin composition comprising the reaction product of
- i) a polyepoxide;
- ii) a curing agent without phenolic hydroxyl moieties;
- iii) cure inhibitor comprising boric acid;
- and
- iv) a catalyst for the reaction of the polyepoxide with the curing agent;
- wherein the partially cured resin is capable of undergoing further curing.
3 more elements
Dependencies are inferred from the claim text.