Sputtering apparatus with a magnet array having a geometry for a specified target erosion profile

A method of configuring a closed-loop magnet means rotatable about an axis for use in a magnetron sputtering apparatus to obtain a desired erosion pattern in a sputter target adjacent to said magnet means, comprising the steps of:

• positioning a closed-loop magnet means having a centerline conforming to a desired shape behind said sputter target,
• forming an erosion groove in said target surface while holding said magnet means in a stationary position,
• measuring the shape and position of the erosion groove,
• adjusting the position of said closed-loop magnet means to have a new centerline at at least one point, such that when said magnet means is rotated a predetermined erosion profile in said sputter target is obtained, taking into account the shape of the erosion groove and the distance between the position of the centerline and the position of the erosion groove.

A method of configuring a closed-loop, rotatable magnet means for use in a magnetron sputtering apparatus to obtain a sputtered film having a desired characteristic on a substrate, said closed-loop magnet being configured to yield a predetermined erosion profile in a sputter target, wherein the shape of said predetermined erosion profile is determined in a manner comprising the following steps:

• determining a distribution function defining to at least the first order the angular distribution of atoms ejected from the surface of a sputter target made of the material being sputtered under the operating conditions of the sputtering apparatus,
• determining the spacing between the surface of the sputter target and the substrate,
• determining the size of the sputter target relative to the size of the substrate, and
• calculating the erosion profile that will result in a desired film characteristic on said substrate, taking into account the operating conditions of the sputtering apparatus, the spacing between the surface of the sputter target and the substrate, the distribution function and the sizes of the substrate and the target.