Method of preparing laminated packaging material
AssigneeToppan Printing Co., Ltd.
InventorYuji Komiya
Life of this patent
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Abstract
A method of preparing a laminated packaging material, comprising forming an extruded coating layer of a thermoadhesive resin on a thin-film layer provided on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties. The thin-film layer is laminated thereon with a heat buffer layer in such a way that the substrate may substantially undergo no expansion and constriction, e.g., by dry lamination or non-solvent lamination. Then the extruded coating layer is formed on the heat buffer layer, after an anchor coat layer has been optionally formed on the heat buffer layer. Such a heat buffer layer is preferably selected from the group consisting of a polyester film, a polyethylene film, a polypropylene film and a polyamide film.
Claims14
A method of preparing a laminated packaging material, comprising the steps of:
- forming a thin-film layer on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties;
- laminating a heat buffer layer on said thin-film layer in such a way that the substrate undergoes no expansion and constriction during the lamination step;
- and
- forming an extruded coating layer on said heat buffer layer.
A method of preparing a laminated packaging material, comprising the steps of:
- forming a thin-film layer on a substrate, said thin-film layer comprising an inorganic or metal compound and having gas barrier properties;
- laminating a heat buffer layer on said thin-film layer in such a way that the substrate undergoes no expansion and constriction during the lamination step;
- forming an anchor coat layer on said heat buffer layer;
- and
- forming an extruded coating layer on said anchor coat layer.
Dependencies are inferred from the claim text.