Method for selectively treating wells with a low viscosity epoxy resin-forming composition

Abstract

Method for selectively treating wells using a low viscosity epoxy resin-forming composition containing a single curing agent. The composition comprises a liquid bisphenol A-based epoxy material and a polyamide hardener for ambient temperature curing of the liquid epoxy material. The epoxy material has a very low viscosity at well surface temperatures and is immiscible with well fluids. The polyamide curing agent used is an amber-colored mobile liquid having a low viscosity at ambient temperature and is further characterized as having long pot life and low exotherm. The method is applicable to plugging permeable zones in a gravel-packed well and may be used to repair leaks in well casing or production tubing and in cementing to prevent communication between subterranean regions.

Dependencies are inferred from the claim text.