Die adhesion testing method and apparatus
AssigneeQuantum Materials, Inc.
InventorFrancis W. Layher
Life of this patent
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Abstract
A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.
Claims20
A coupling assembly for coupling the surfaces of a semiconductor chip and its supporting carrier substrate to a tensile testing machine for testing the strength of a bond between the chip and the carrier substrate, comprising in combination:
- a semiconductor chip and a substrate, said chip bonded to a supporting surface of said substrate,
- a pair of connector blocks, each having a bonding end, with a substantially planar bonding face for bonding to the surface of one of said chip and said substrate and a connector end with detachable connecting means for mounting in a tensile testing machine.
A connector assembly for connecting to opposite surfaces of a sandwich for testing the strength of an adhesive bond between a pair of surfaces, said connector assembly, comprising in combination:
- a semiconductor chip and a substrate, said semiconductor chip bonded to a surface of said substrate;
- a pair of connector blocks for bonding to oppositely directed faces of said semiconductor chip and said substrate to which the chip is bonded, each connector block having a bonding end and a connector end;
- and
- connecting means including a swivel assembly for connecting to said connector end for mounting in a tension test stand for testing the bond between said chip and said substrate.
A method for testing the tensile strength of a bond between a chip and a substrate, the steps comprising:
- selecting a pair of connector blocks, each block having a substantially planar connecting face for bonding to oppositely directed faces of said chip and substrate, and a coupling end for mounting in a tensile testing machine;
- bonding a connecting face of said pair of connector blocks to each one of said oppositely directed faces of said chip and substrate;
- and
- applying a selected amount of aligned tension via said connector blocks to said chip and substrate.
Dependencies are inferred from the claim text.