Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein
AssigneeShin-Etsu Handotai Co., Ltd.
InventorKohei Toyama
Life of this patent
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Abstract
An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of the ingot to obtain wafers, of which the improvement lies in that the cutting load which the blade of the ID saw slicing machine imposes upon the single crystal ingot is continually detected in terms of three vector elements along three mutually perpendicular directions throughout the slicing operation, and that, when the magnitude of that vector element of the cutting load which extends in the slicing direction exceeds a predetermined value, the feed rate of the ingot to the blade is decreased and, at the same time, the rotational speed of the blade is increased in accordance with a predetermined control pattern.
Claims14
An improved method of using an ID saw slicing machine having a blade which is rotated at high speeds for slicing a single crystal ingot in a direction normal to the axis of the ingot to obtain wafers, wherein the cutting load which the blade of the ID saw slicing machine imposes upon the single crystal ingot is continually detected in terms of three vector elements along three mutually perpendicular directions including said slicing direction throughout the slicing operation, and that, when the magnitude of that vector element of the cutting load which extends in the slicing direction exceeds a predetermined value, the feed rate of the ingot to the blade is decreased and, at the same time, the rotational speed of the blade is increased in accordance with a predetermined control pattern.
An apparatus for slicing a single crystal ingot having an ID saw slicing machine for slicing the single crystal ingot in a direction normal to the axis of the ingot, a drive means for rotating a blade of the ID saw slicing machine at a constant speed, a means for measuring wobble displacement of the blade of the ID saw slicing machine, a dressing means for dressing the grinder edge of the ID saw slicing machine, and a shift means for shifting either the body consisting of the ID saw slicing machine the drive means or the single crystal ingot in a manner such that the ingot is caused to be sliced in the direction normal to its axis, a piezoelectric load detector for detecting the cutting load the single crystal ingot receives in terms of three vector elements along three mutually perpendicular directions including said slicing direction, and a control means for controlling the shift means and drive means, respectively, in a manner such that, when the magnitude of that vector element of the cutting load which extends in the slicing direction exceeds a predetermined value, the feed rate of the ingot to the blade is decreased and, at the same time, the rotational speed of the blade is increased in accordance with a predetermined control pattern.
Dependencies are inferred from the claim text.