Methods for packaging circuit boards
AssigneeUnisys Corporation
InventorsD. Edmond Freige, Richard N. Hibbs
Life of this patent
Estimating the term…
Abstract
Embodiments disclose modular packaged circuit-boards (plug-in "cards") packaged in like modules, and cooled along with a motherboard in an integrated design.
Claims28
A method of providing removeable circuit package means for use with prescribed base means that includes receiving-circuit board means and superposed deck means including slot means and deck-vent holes, this method means comprising:
- arranging said removable circuit board means to include connector means arranged to be removably connected into said receiving-board means;
- and providing nonconductive envelope means about said removeable board means, while constructing this envelope means to house and closely surround said removeable circuit board means, and to be relatively square and include tang means projected centrally from a bottom-edge portion thereof surrounding said connector means, while arranging and adapting said envelope means to interfit with a receiving one of said slot means in said deck means, and to include vent aperture means adapted for registry with respective ones of said deck vent holes;
- at said bottom-edge portion of said tang means;
- while, further, making said envelope means to also include upper vent means along an upper-edge portion, opposite said bottom-edge portion, and also to include cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit-board means, to exit through said vent aperture means in said bottom-edge portion and onto said receiving board means for cooling thereof.
A method of improving data handling apparatus including N circuit-package means, cover means disposed about said circuit-package means, and base means including slotted deck means and motherboard means mounted thereunder;
- this deck means including N sets of apertures therein, each set being identical, placed side-by-side in parallel, and comprising a connector-slot flanked by one or more vent-slots;
- each said circuit-package means comprising circuit means including connector means, packaged in essentially-identical, nonconductive envelope means, with
- each connector means arranged to be connected-into said motherboard means;
- this method comprising:
- constructing each envelope means to house and closely-surround a respective circuit means, making each said envelope means to include a bottom-edge portion with vent means and to include tang means surrounding said connector means projected centrally from a bottom-edge segment thereof, this segment being different from said bottom-edge portion and being arranged and adapted to interfit with a receiving one of said connector slots in said deck means;
- also making each said envelope means to also include vent means whereby to conduct coolant-air from upper portions thereof, down across its circuit means, to exit through said vent-means in said bottom edge portion, then onto said motherboard means for cooling thereof.
A method of enhancing a control circuit array which includes:
- one or more circuit-package means and associated receiving base means, which, in turn, includes receiving-circuit-board means having an array of N connector-receptacle means, plus deck means superposed over said board means and including vent holes and N sets of apertures, each set comprising a slot superposed above a respective one of said receptable means plus one or more flanking vents;
- this method comprising:
- making each said circuit-package means to comprise:
- circuit board means including connector means arranged to be removably connected-into said receiving-board means;
- and providing nonconductive envelope means to house and closely-surround said circuit-board means, making this envelope means to be relatively square and to include tang means projected centrally from a bottom-edge portion thereof surrounding said connector means, and being arranged and adapted to interfit with a receiving one of said slot means in said deck means, said bottom-edge portion also including vent aperture means adapted for registry with respective ones of said deck vent holes;
- while, further, making said envelope means to also include upper vent means along an upper-edge portion, opposite said bottom-edge portion, and to also include cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit-board means, to exit through said vent aperture means in said bottom edge portion and onto said receiving-board means for cooling thereof.
A method of providing an array of essentially-identical circuit package means for use with prescribed base means, which includes receiving-circuit-board means having an array of N connector-receptacle means plus deck means which is superposed over said board means and which includes N sets of apertures, each set comprising a slot superposed above a respective one of said receptacle means plus one or more flanking vents;
- this method including:
- making each said package means to comprise:
- plug-in circuit board means which includes connector means arranged to be removably connected-into said receiving-board means;
- and to also include nonconductive envelope means which is constructed and adapted to house and to closely-surround said plug-in circuit board means, while further arranging said envelope means to be relatively square and to include tang means projected centrally from a bottom-edge portion thereof surrounding said connector means, and being arranged and adapted to interfit with a receiving one of said slots in said deck means, said bottom-edge portion also including vent aperture means adapted for registry with respective ones of said deck vents;
- while further making said envelope means to also include upper vent means along an upper-edge portion, opposite said bottom-edge portion, and also to include cooling-vent slit means in other portions of said envelope means whereby to conduct coolant-air from upper portions thereof, down across the circuit board means, to exit through said vent aperture means in said bottom edge portion and onto said receiving-board means for cooling thereof.
Dependencies are inferred from the claim text.