Semiconductor memory control device and method of mounting same in high density
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorMasatoshi Kimura
Life of this patent
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Abstract
A semiconductor memory control device includes a flexible circuit board having a plurality of panels and folded so that the panels are stacked on one another, a plurality of semiconductor elements mounted on the flexible circuit board, and a package enclosing the flexible circuit board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density includes mounting a plurality of semiconductor elements on a flexible circuit board, forming an internally mounted module by folding the flexible circuit board in panels that are stacked in multiple layers, and enclosing the internally mounted module in a package.
Claims24
A semiconductor memory control device comprising:
- a flexible circuit board folded to form layers of panels stacked relative to one another;
- a plurality of semiconductor elements mounted on the flexible circuit board;
- and
- a package body enclosing the flexible circuit board and the plurality of semiconductor elements and including a sheathing frame having grooves engaging edges of the panels of the flexible circuit board.
A semiconductor memory control device comprising:
- a flexible circuit board folded to form layers of panels stacked relative to one another wherein an outermost panel of the folded flexible circuit board is free of semiconductor elements and is a ground plane;
- a plurality of semiconductor elements mounted on the flexible circuit board;
- and
- a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
A semiconductor memory control device comprising:
- a flexible circuit board folded to form layers of panels stacked relative to one another wherein at least one panel of the flexible circuit board is free of semiconductor elements and is a shield disposed between two other panels of the flexible circuit board on which semiconductor elements are mounted for shielding the semiconductor elements on the two panels from each other;
- a plurality of semiconductor elements mounted on the flexible circuit board;
- and
- a package body enclosing the flexible circuit board and the plurality of semiconductor elements.
A method of mounting semiconductor memory control devices in high density comprising:
- mounting a plurality of semiconductor elements on a flexible circuit board including a plurality of panels;
- forming an internally mounted module by folding the flexible circuit board to form multiple panels stacked relative to one another;
- and
- enclosing the internally mounted module in a package comprising a sheathing frame having grooves including inserting edges of the flexible circuit board having a plurality of semiconductor elements mounted thereon in the grooves.
Dependencies are inferred from the claim text.