US 5,313,367 AGranted

Semiconductor device having a multilayer interconnection structure

AssigneeSeiko Epson Corporation

InventorHisanobu Ishiyama

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Abstract

Actualized are fingers through which a semiconductor integrated circuit including high density electrode strings can be easily safely mounted on a circuit substrate in the same manner with the prior art. A conductor pattern capable of improving a packaging density of the integrated circuit including the fingers is actualized. The fingers are therefore configured using the multi-layered conductor pattern. The conductor pattern is multi-layered, i.e., consists of conductive layers and an insulating layer for separating these conductive layers. In addition to a wiring pattern serving as fingers for connecting an integrated circuit to a packaging substrate, an electrification path for interlayer connections is also formed in a thickness direction. The circuit substrate exhibiting a high packaging density can be actualized.

Claims18

Dependent claims

A semiconductor device comprising:

a multi-layer interconnection structure arranged on a substrate comprising
a first layer of first electrically conducting fingers,
a second layer of second electrically conducting fingers, and
an electrically insulating material arranged between said first and second layers;
and
a second interconnection structure arranged on the substrate comprising a plurality of third electrically conducting fingers,
said first electrically conducting fingers of said multi-layer interconnection structure being in electrical communication with corresponding first electrodes of a first integrated circuit, said second electrically conducting fingers of said multi-layer interconnection structure being in electrical communication with corresponding first electrodes of a second integrated circuit, and said third electrically conducting fingers of said second interconnection structure being in electrical communication with corresponding second electrodes of the first and second integrated circuits.

4 more elements

Dependencies are inferred from the claim text.