Direct chip attach module (DCAM)
AssigneeInternational Business Machines Corporation
InventorsGene J. Gaudenzi, Perwaiz Nihal
Life of this patent
Estimating the term…
Abstract
A low cost Surface Mount Carrier (SMC) for carrying integrated circuit chips mounted thereon. The carrier, or interposer, is a thin-small single layer or, a multi-layer deck of printed circuit board (FR-4) material with at least one direct chip attach (DCA) site for mounting a semiconductor chip. The DCA site has chip bonding pads wherein the integrated circuit chip's pads are wire bonded to or soldered to the carrier. The bonding pads are connected to wiring pads through interlevel vias and wiring lands or traces which may be on one of several wiring planes. The carrier is connected to the next level of packaging through the wiring pads.
Claims15
An integrated circuit module comprising:
- a carrier, said carrier comprising:
- chip mounting means for fixedly mounting at least one integrated circuit chip to said carrier, and
- distribution means for distributing said power and said signals to said at least one integrated circuit chip, said distribution means comprised of a plurality of carrier pads connected to a plurality of chip bonding pads by carrier wiring on at least one conductive plane, said conductive plane being on at least one layer of resin fiberglass composite material;
- said carrier being selected from at least two carriers with different distribution means, whereby two chips with identical function, but incompatible footprints, become interchangeable in an integrated circuit chip;
- the integrated circuit chip package;
- and,
- bonding means for mounting and connecting the carrier to said package.
An integrated circuit package comprising:
- a carrier, said carrier comprising:
- a plurality of wiring planes,
- a plurality of insulating layers of resin fiberglass composite material, each said insulating layer being sandwiched between an adjacent pair of said wiring planes,
- a plurality of vias, each of said vias extending from one of said wiring planes through at least one of said insulating layers to a second of said wiring planes,
- a plurality of carrier pads, and
- at least one chip mounting location on a surface of said carrier, said mounting location having a plurality of chip power and signal pads;
- said carrier being selected from at least two different carriers, the mounting location of one said carrier having a different chip power and signal assignment than the other said carrier, whereby two chips with identical functions, but incompatible footprints, become interchangeable in said package;
- and
- means for providing signal and power to said carrier.
Dependencies are inferred from the claim text.