Broadband tight coupled microstrip line structures
AssigneeITT Corporation
InventorsInder J. Bahl, David A. Willems
Life of this patent
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Abstract
A coupled line structure for microwave signals employs a gallium-arsenide substrate having an embedded metallic line located on a surface of the substrate. The surface of the substrate is covered with a thin dielectric layer and at least another metallic line is positioned on the dielectric layer and parallel to the embedded line with a portion of the lines overlapping one another for coupling. A third line can also be disposed on the dielectric layer which line is parallel to the other lines and where the embedded line is connected by a via hole to one of the lines on the dielectric.
Claims13
A microwave coupled line apparatus for providing tight coupling at microwave frequencies, comprising:
- a substrate formed of a semiconductor material and having a top surface, a bottom surface, a first end, and a second end;
- a first embedded metal line located on said top surface of said substrate and extending from said first end of said substrate to said second end of said substrate;
- a dielectric layer covering said first metal line and said top surface of said substrate;
- a second metal line positioned on said dielectric layer also extending from said first end of said substrate to said second end of said substrate and positioned such that;
- a first portion of said first metal line is overlapped by a first portion of said second metal line, a second portion of said first metal line and a second portion of said second metal line not overlapping;
- and
- a ground plane on said bottom surface of said substrate.
Dependencies are inferred from the claim text.